-Review operations and confer
with technical or administrative staff to resolve production or processing
problems.

审查操作，并与技术或行政人员协商解决生产或加工问题

-Hire, train, evaluate, retain and
discharge staff, establish a highly united team with good team spirit and
resolve personnel grievances.

雇佣、培训、评估、留住和解雇员工，建立高度团结的团队，具有良好的团队精神，并解决员工不满

-Initiate and coordinate cost
control programs related to Assembly.

启动和协调与装配相关的成本控制计划

-Work with Quality department to
continuously improve quality and yield.

与质量部门合作，不断提高质量和产量

-Support R & D to develop new

products and processes.

支持研发开发新产品和新工艺

-Develop budgets and approve

expenditures for supplies, materials, and human resources, ensuring that
materials, labor and equipment are used efficiently to meet production targets.

制定预算并批准用品、材料和人力资源的支出，确保有效使用材料、劳动力和设备以实现生产目标

-Review processing schedules and

production orders to make decisions concerning staffing requirements, work
procedures, and duty assignments, considering budgetary limitations and time
constraints.

考虑到预算限制和时间限制，审查加工计划和生产订单，以做出有关人员配置要求、工作程序和职责分配的决定

-Responsible for deploying and achieving the KPI’s

from site president down to direct and indirect reports

负责部署和实现从现场总裁到直接和间接报告的KPI

JOB REQUIREMENTS:

任职资格:

-BS

in Engineering or Business.

工程或商业学士

-Minimum
8 years working experience in high volume electronics manufacturing
environment preferably semiconductor assembly environment.

至少8年在大批量电子制造环境中的工作经验，最好是半导体组装环境。

-Minimum
of 4 years’ experience in management and preferred with experience in technical
leadership of engineering staff.

至少4年管理经验，有工程人员技术领导经验者优先。

-In depth knowledge of the
sub-con semiconductor industry.

对半导体行业有深入了解

-Excellent
motivation, communication and presentation skills (written and verbal).

优秀的动机、沟通和表达能力（书面和口头）

-Highly-developed

interpersonal and people management/development skills

高度发展的人际关系和人员管理/发展技能

Essential Skills / Attitude

基本技能/态度