KEY TASKS & RESPONSIBILITIES:

工作职责:

§ Technical
skills and knowledge on assembly packaging.

§ Lead
project for New Product Introduction.

§ Review
the new device, package design of customer’s enquiries.

§ Plan
and organize assembly evaluation for New Product Introduction

§ Prepare
presentation material and compiled technical assembly report for the project.

§ New
Project execution thru APQP methodology and update/upload in eNPI system

§ Implement
quality, environmental, and occupational health and safety policies, achieve
departmental goals and targets; Responsible for the operational control of
environmental management and occupational health and safety management in the
department;

JOB REQUIREMENTS:

任职资格:

§ Bachelor’s
Degree in Electronics, Electrical, Mechanical Engineering or related
engineering discipline.

§ Over
5 years working experience in related process in high volume electronics
manufacturing environment preferably semiconductor.

§ Knowledge in
APQP, DOE, SPC, FMEA and MSA.

§ Apply
full understanding of engineering principles in performing job responsibility.

§ Good
command in both spoken and written in English and Chinese / Mandarin.

§ Knowledge in Microsoft Office.

§ Able
to work with cross functional team and with minimum supervision.

§ Effective
interpersonal and communication skills.

§ Familiar
with RoHS, HF, REACH, MCD/MSDS control limits and chemical composition
declaration

§ Familiar
with the control of green and non-green products of the company