该岗位为Apple 产品可靠性岗位，display/battery/iphone/mac方向均可，工作地点有上海/深圳/成都。

岗位职责

1. 准备简明详细的可靠性测试计划，开发新的可靠性测试、程序和规范 •

2. 以清晰的组织形式报告测试结果，并强调或优先级以满足具有挑战性的项目截止日期 •

3. 分析测试数据，协助跨职能团队进行故障分析，为可靠性决策提供依据 •

4. 利用先进的技术来了解测试失败的根本原因。与研发部交流测试结果，解决遇到的问题。

任职资格 •

1. 有主板测试、电子芯片封装和测试经验。

2. 良好的英语口语和书面表达能力。 •

3. 熟悉环境或机械应力测试，如高温高湿、跌落、振动测试;或了解JEDEC, IEC, ASTM等测试标准

4. 熟悉常用的失效分析技术，如显微镜、x射线、ct扫描、SEM、TEM、FIB、EDS、LIT、CSAM… •

5. 有一定的统计学知识。熟悉DOE, FMEA, SPC或六西格玛认证。 •

6. 能够接受出差，理工科本科及以上学历，电子工程相关专业。

Responsibilities We are seeking a highly motivated individual with background in creation and execution of reliability tests and identification of potential failure modes. You will be responsible for developing and executing novel test methodologies to validate the robustness of products, sub-assemblies, modules, and supplier technologies. In addition, the candidate will coordinate failure analysis to identify root causes and corrective actions. Job describtion • Preparing concise and detailed reliability test plans • Developing new reliability tests, procedures, and specifications • Reporting test results in clearly organized formats, and with emphasis or prioritization to meet challenging project deadlines • Analyzing test data to assist cross functional teams’ failure analysis and offer basis of reliability decision making • Scoping state-of-the-art techniques to understand test failure’s root cause. Interacting with diverse cross functional teammates to communicate test results and provide inputs for problem solving as a whole team. Qualifications • Familiar with environmental or mechanical stress tests, such as high temperature high humidity, drop, vibration test; or some knowledge of test standards from JEDEC, IEC, ASTM… • Familiar with common failure analysis techniques such as microscopy, X-ray, CT-scan, SEM, TEM, FIB, EDS, LIT, CSAM… • Some level of statistics knowledge. Familiar with DOE, FMEA, SPC, or Six Sigma certified. • Excellent interpersonal skills: the candidate must feel comfortable to express opinions in front of audience at all grades. Able to stand up for what is right based on data, meanwhile be openminded and thus able to listen and understand other team members’ thoughts. • Multi-tasking and good at time management so as to report data/results timely under big time pressure. • Strong attention to details among large amount of technical data. • Eager to step out of comfort zone to explore uncharted territories, which need some self learning or develop some new skills for new projects or un-precedent tasks. • Good at both verbal and written English. • Able to travel unrestrictedly. Education and Experience • Bachelor degree or above in science or engineering. Major in electronic engineering is preferred. • Preferred - experience on SMT or PCB, or electronic chip, or electronic chip packaging and testing.