任職資格:

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Bachelor Degree in Material Science, Applied
Physics, Electron Engineering, related engineering discipline.

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Bachelor Degree with at least 3 years working
experience in related process in high volume electronics manufacturing
environment preferably semiconductor.

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Familiar with package saw process is must.

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Familiar with Disco tape saw DFD641/ DFD6362 and
jig saw hanmi 3500S/ Rokko 7000S is preferred.

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A team minded person capable of working
independently, keeping a positive attitude.

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Be familiar for office software application.